Electronica: Tria’s OSM-SB-EP5 aims to shorten concept-to-product time - Electronics Weekly
Tria Technologies has introduced the OSM-SB-EP5 carrier board to accelerate development of embedded products using the Open Standard Module (OSM) standard.
The OSM-SB-EP5 is designed for teams building embedded products around the Open Standard Module standard. It allows engineers to assess system architectures, verify application requirements and reduce project risk during the evaluation and prototyping phase.
OSM brings standardization and flexibility similar to Computer-On-Module and System-On-Module solutions to smaller, higher-volume embedded products where traditional connector-based modules are impractical due to size or cost constraints.
Technical Features
As a carrier board, the OSM-SB-EP5 serves as a baseboard that breaks out inputs, outputs, and interfaces. The processing power comes from interchangeable OSM modules fitted to the board. Before developing an application-specific carrier board, engineers can use this platform for testing architectures, interfaces, connectivity requirements, and creating proof-of-concepts.
The board supports Tria's Size-S, -M and -L form factor OSM modules and includes NOR Flash with Quad SPI, 2x Gigabit Ethernet ports with S/RGMII PHYs, Single Pair Ethernet with SGMII PHY, USB connectivity, LVDS and MIPI-DSI display interfaces, 2x UARTs, 2x CAN buses, internal buses and general IO.
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